HSE05-171933 CUI Devices
auf Bestellung 1441 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.31 EUR |
| 10+ | 2.22 EUR |
| 25+ | 2.16 EUR |
| 50+ | 2.02 EUR |
| 100+ | 1.81 EUR |
| 250+ | 1.8 EUR |
| 500+ | 1.69 EUR |
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Technische Details HSE05-171933 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Box, Material: Aluminum Alloy, Length: 0.764" (19.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Width: 0.669" (17.00mm), Package Cooled: TO-218, TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 3.98W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.83°C/W, Fin Height: 1.280" (32.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE05-171933 nach Preis ab 1.71 EUR bis 2.41 EUR
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HSE05-171933 | Hersteller : Same Sky |
 Description: HEAT SINK, EXTRUSION, TO-218/TO-Packaging: Box Material: Aluminum Alloy Length: 0.764" (19.40mm) Shape: Rectangular, Angled Fins Type: Board Level Width: 0.669" (17.00mm) Package Cooled: TO-218, TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 3.98W @ 75°C Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM Thermal Resistance @ Natural: 18.83°C/W Fin Height: 1.280" (32.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1650 Stücke: Lieferzeit 10-14 Tag (e) |
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