HSE05-171933 CUI Devices
auf Bestellung 1441 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 3.28 EUR |
| 25+ | 3.2 EUR |
| 50+ | 2.99 EUR |
| 100+ | 2.68 EUR |
| 250+ | 2.65 EUR |
| 500+ | 2.49 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSE05-171933 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Box, Material: Aluminum Alloy, Length: 0.764" (19.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Width: 0.669" (17.00mm), Package Cooled: TO-218, TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 3.98W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.83°C/W, Fin Height: 1.280" (32.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE05-171933 nach Preis ab 2.44 EUR bis 3.38 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSE05-171933 | Hersteller : CUI Devices |
 Description: HEAT SINK, EXTRUSION, TO-218/TO-Packaging: Box Material: Aluminum Alloy Length: 0.764" (19.40mm) Shape: Rectangular, Angled Fins Type: Board Level Width: 0.669" (17.00mm) Package Cooled: TO-218, TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 3.98W @ 75°C Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM Thermal Resistance @ Natural: 18.83°C/W Fin Height: 1.280" (32.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1663 Stücke: Lieferzeit 21-28 Tag (e) |
|