HSE06-503045 CUI Devices
auf Bestellung 776 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 5.49 EUR |
| 25+ | 5.33 EUR |
| 50+ | 5.02 EUR |
| 100+ | 4.5 EUR |
| 250+ | 4.42 EUR |
| 500+ | 4.16 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSE06-503045 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 1.969" (50.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.181" (30.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Clip, Power Dissipation @ Temperature Rise: 12.79W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 5.86°C/W, Fin Height: 1.772" (45.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE06-503045 nach Preis ab 4.19 EUR bis 5.72 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSE06-503045 | Hersteller : CUI Devices |
 Description: HEAT SINK, EXTRUSION, TO-218/TO-Packaging: Bag Material: Aluminum Alloy Length: 1.969" (50.00mm) Shape: Rectangular, Fins Type: Board Level Width: 1.181" (30.00mm) Package Cooled: TO-218, TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 12.79W @ 75°C Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM Thermal Resistance @ Natural: 5.86°C/W Fin Height: 1.772" (45.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 990 Stücke: Lieferzeit 21-28 Tag (e) |
|