HSE08-505028 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 1.969" (50.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level
Width: 1.102" (28.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 10.53W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.13°C/W
Fin Height: 1.969" (50.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 100 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 5.9 EUR |
| 10+ | 5.7 EUR |
| 25+ | 5.54 EUR |
| 50+ | 5.21 EUR |
| 100+ | 4.68 EUR |
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Technische Details HSE08-505028 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 1.969" (50.00mm), Shape: Rectangular, Angled Fins, Type: Board Level, Width: 1.102" (28.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Clip, Power Dissipation @ Temperature Rise: 10.53W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.13°C/W, Fin Height: 1.969" (50.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE08-505028 nach Preis ab 4.97 EUR bis 6.66 EUR
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HSE08-505028 | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 50 x 50 x 28 mm |
auf Bestellung 762 Stücke: Lieferzeit 14-28 Tag (e) |
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