HSE12-B20-NP CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular
Type: Top Mount
Width: 0.472" (12.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.94W @ 75°C
Thermal Resistance @ Forced Air Flow: 19.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 38.75°C/W
Fin Height: 0.177" (4.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1969 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 20+ | 1.3 EUR |
| 25+ | 1.26 EUR |
| 50+ | 1.19 EUR |
| 100+ | 1.07 EUR |
| 250+ | 1.05 EUR |
| 500+ | 0.98 EUR |
| 1000+ | 0.97 EUR |
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Technische Details HSE12-B20-NP CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Rectangular, Type: Top Mount, Width: 0.472" (12.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 1.94W @ 75°C, Thermal Resistance @ Forced Air Flow: 19.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 38.75°C/W, Fin Height: 0.177" (4.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE12-B20-NP nach Preis ab 0.99 EUR bis 1.35 EUR
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HSE12-B20-NP | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 25 x 12 x 4.5 mm, 3.2 mm hole |
auf Bestellung 1975 Stücke: Lieferzeit 14-28 Tag (e) |
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