HSEC8-130-01-L-DV-A-WT-K Samtec
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 7.32 EUR |
| 280+ | 6.95 EUR |
| 560+ | 6.85 EUR |
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Technische Details HSEC8-130-01-L-DV-A-WT-K Samtec
Description: CONN EDGE DUAL FMALE 60POS 0.031, Features: Board Guide, Solder Retention, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: Non Specified - Dual Edge, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Beryllium Copper, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Weitere Produktangebote HSEC8-130-01-L-DV-A-WT-K nach Preis ab 7.05 EUR bis 11.56 EUR
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HSEC8-130-01-L-DV-A-WT-K | Hersteller : Samtec Inc. |
 Description: CONN EDGE DUAL FMALE 60POS 0.031Features: Board Guide, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: Non Specified - Dual Edge Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
auf Bestellung 124 Stücke: Lieferzeit 10-14 Tag (e) |
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