HSS-B20-061H-03 CUI Devices
Hersteller: CUI DevicesDescription: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.512" (13.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.512" (13.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.86°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2955 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 1.04 EUR |
| 18+ | 0.99 EUR |
| 25+ | 0.94 EUR |
| 50+ | 0.91 EUR |
| 100+ | 0.9 EUR |
| 250+ | 0.84 EUR |
| 500+ | 0.79 EUR |
| 1000+ | 0.71 EUR |
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Technische Details HSS-B20-061H-03 CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.512" (13.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 0.512" (13.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.86°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-061H-03
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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HSS-B20-061H-03 | Hersteller : CUI Devices |
Heat Sinks 19 x 13 x 12.7mm TO-220 solder pin |
Produkt ist nicht verfügbar |