HSS-B20-061H-03 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.512" (13.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.512" (13.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.86°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2408 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 18+ | 1.02 EUR |
| 20+ | 0.9 EUR |
| 25+ | 0.85 EUR |
| 50+ | 0.82 EUR |
| 100+ | 0.79 EUR |
| 250+ | 0.76 EUR |
| 500+ | 0.73 EUR |
| 1000+ | 0.7 EUR |
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Technische Details HSS-B20-061H-03 Same Sky (Formerly CUI Devices)
Description: HEATSINK TO-220 2.9W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.512" (13.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 0.512" (13.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.72°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.86°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-061H-03
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
HSS-B20-061H-03 | Hersteller : CUI Devices |
Heat Sinks 19 x 13 x 12.7mm TO-220 solder pin |
Produkt ist nicht verfügbar |
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| HSS-B20-061H-03 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; U; TO220; black; L: 19mm; W: 13mm; H: 2.7mm; PCB Type of heatsink: extruded Heatsink shape: U Application: TO220 Colour: black Length: 19mm Width: 13mm Height: 2.7mm Material: aluminium Material finishing: anodized Mounting: PCB Thermal resistance @200 LFM: 5.72°C/W Base thickness: 800µm Thermal resistance: max. 31.07°C/W |
Produkt ist nicht verfügbar |