HSS-B20-0635H-02 CUI Devices
auf Bestellung 2799 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 0.82 EUR |
| 10+ | 0.78 EUR |
| 25+ | 0.74 EUR |
| 50+ | 0.73 EUR |
| 100+ | 0.71 EUR |
| 250+ | 0.67 EUR |
| 500+ | 0.63 EUR |
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Technische Details HSS-B20-0635H-02 CUI Devices
Description: HEATSINK TO-220 2.6W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.520" (13.20mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.500" (12.70mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.6W @ 75°C, Thermal Resistance @ Forced Air Flow: 10.49°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.09°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-0635H-02 nach Preis ab 0.55 EUR bis 0.83 EUR
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HSS-B20-0635H-02 | Hersteller : CUI Devices |
 Description: HEATSINK TO-220 2.6W ALUMINUMPackaging: Bag Material: Aluminum Length: 0.520" (13.20mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.6W @ 75°C Thermal Resistance @ Forced Air Flow: 10.49°C/W @ 200 LFM Thermal Resistance @ Natural: 29.09°C/W Fin Height: 0.748" (19.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 5001 Stücke: Lieferzeit 10-14 Tag (e) |
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