auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 0.78 EUR |
| 10+ | 0.75 EUR |
| 25+ | 0.71 EUR |
| 50+ | 0.7 EUR |
| 100+ | 0.69 EUR |
| 250+ | 0.64 EUR |
| 500+ | 0.6 EUR |
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Technische Details HSS-B20-0635H CUI Devices
Description: HEATSINK TO-220 2.6W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.520" (13.20mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.250" (6.35mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.6W @ 75°C, Thermal Resistance @ Forced Air Flow: 10.68°C/W @ 200 LFM, Thermal Resistance @ Natural: 28.85°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-0635H nach Preis ab 0.55 EUR bis 0.79 EUR
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HSS-B20-0635H | Hersteller : CUI Devices |
 Description: HEATSINK TO-220 2.6W ALUMINUMPackaging: Bag Material: Aluminum Length: 0.520" (13.20mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.250" (6.35mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.6W @ 75°C Thermal Resistance @ Forced Air Flow: 10.68°C/W @ 200 LFM Thermal Resistance @ Natural: 28.85°C/W Fin Height: 0.748" (19.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1274 Stücke: Lieferzeit 10-14 Tag (e) |
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