HSS-B20-0953H-01 CUI Devices
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 1.02 EUR |
| 10+ | 0.97 EUR |
| 25+ | 0.92 EUR |
| 50+ | 0.9 EUR |
| 100+ | 0.88 EUR |
| 250+ | 0.82 EUR |
| 500+ | 0.77 EUR |
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Technische Details HSS-B20-0953H-01 CUI Devices
Description: HEATSINK TO-220 2.3W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.500" (12.70mm), Shape: Rectangular, Fins, Type: Board Level, Width: 0.504" (12.80mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM, Thermal Resistance @ Natural: 33.28°C/W, Fin Height: 0.590" (15.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-0953H-01 nach Preis ab 0.71 EUR bis 1.04 EUR
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HSS-B20-0953H-01 | Hersteller : CUI Devices |
 Description: HEATSINK TO-220 2.3W ALUMINUMPackaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.3W @ 75°C Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM Thermal Resistance @ Natural: 33.28°C/W Fin Height: 0.590" (15.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2851 Stücke: Lieferzeit 10-14 Tag (e) |
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