HSS-B20-095H CUI Devices
Hersteller: CUI DevicesDescription: HEATSINK TO-220 4.1W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.441" (11.20mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.34°C/W
Fin Height: 0.626" (15.90mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1106 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.36 EUR |
| 14+ | 1.28 EUR |
| 25+ | 1.22 EUR |
| 50+ | 1.18 EUR |
| 100+ | 1.17 EUR |
| 250+ | 1.09 EUR |
| 500+ | 1.02 EUR |
| 1000+ | 0.93 EUR |
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Technische Details HSS-B20-095H CUI Devices
Description: HEATSINK TO-220 4.1W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.441" (11.20mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.866" (22.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 4.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.34°C/W, Fin Height: 0.626" (15.90mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-095H
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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HSS-B20-095H | Hersteller : CUI Devices |
Heat Sinks 19 x 22 x 11.2mm TO-220 solder pin |
Produkt ist nicht verfügbar |