HSS01-B20-CP CUI Devices
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.85 EUR |
| 10+ | 1.76 EUR |
| 25+ | 1.72 EUR |
| 50+ | 1.7 EUR |
Produktrezensionen
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Technische Details HSS01-B20-CP CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 49., Packaging: Box, Material: Aluminum Alloy, Length: 1.941" (49.31mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 1.900" (48.26mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 9.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.59°C/W, Fin Height: 0.950" (24.13mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS01-B20-CP nach Preis ab 1.73 EUR bis 2.68 EUR
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HSS01-B20-CP | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, STAMPING, TO-220, 49.Packaging: Box Material: Aluminum Alloy Length: 1.941" (49.31mm) Shape: Rectangular Type: Board Level, Vertical Width: 1.900" (48.26mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 9.9W @ 75°C Thermal Resistance @ Forced Air Flow: 3.70°C/W @ 200 LFM Thermal Resistance @ Natural: 7.59°C/W Fin Height: 0.950" (24.13mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 529 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS01-B20-CP | Hersteller : Same Sky |
Heat Sinks heat sink, stamping, TO-220, 49.31 x 48. |
auf Bestellung 662 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSS01-B20-CP | Hersteller : CUI DEVICES |
Stamped Heat Sink, TO-220, Aluminum, PCB, 8.26 mm Horizontal Solder Pin |
Produkt ist nicht verfügbar |