HSS02-B20-P318 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 23.
Packaging: Box
Material: Aluminum Alloy
Length: 1.900" (48.26mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.930" (23.62mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.90°C/W
Fin Height: 0.950" (24.13mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1436 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.81 EUR |
| 25+ | 1.76 EUR |
| 50+ | 1.71 EUR |
| 100+ | 1.62 EUR |
| 250+ | 1.52 EUR |
| 500+ | 1.43 EUR |
| 1000+ | 1.33 EUR |
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Technische Details HSS02-B20-P318 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 23., Packaging: Box, Material: Aluminum Alloy, Length: 1.900" (48.26mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.930" (23.62mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 6.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.90°C/W, Fin Height: 0.950" (24.13mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS02-B20-P318 nach Preis ab 2.1 EUR bis 2.83 EUR
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HSS02-B20-P318 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 23.62 x 48. |
auf Bestellung 1645 Stücke: Lieferzeit 14-28 Tag (e) |
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