HSS04-B20-P318 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 41.
Packaging: Box
Material: Aluminum Alloy
Length: 1.650" (41.91mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 1.750" (44.45mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.79°C/W
Fin Height: 0.380" (9.65mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1968 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 2.96 EUR |
| 10+ | 2.82 EUR |
| 25+ | 2.74 EUR |
| 50+ | 2.67 EUR |
| 100+ | 2.52 EUR |
| 250+ | 2.37 EUR |
| 500+ | 2.22 EUR |
| 1000+ | 2.08 EUR |
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Technische Details HSS04-B20-P318 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 41., Packaging: Box, Material: Aluminum Alloy, Length: 1.650" (41.91mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 1.750" (44.45mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 5.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.79°C/W, Fin Height: 0.380" (9.65mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS04-B20-P318 nach Preis ab 2.26 EUR bis 3.02 EUR
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HSS04-B20-P318 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 41.91 x 44. |
auf Bestellung 1984 Stücke: Lieferzeit 14-28 Tag (e) |
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