HSS05-C20-SMT-TR CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 12.
Packaging: Tape & Reel (TR)
Material: Copper Alloy
Length: 1.031" (26.20mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 32.69°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1250 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 250+ | 1.88 EUR |
| 500+ | 1.77 EUR |
| 1250+ | 1.61 EUR |
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Technische Details HSS05-C20-SMT-TR CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 12., Packaging: Tape & Reel (TR), Material: Copper Alloy, Length: 1.031" (26.20mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.500" (12.70mm), Package Cooled: TO-220, Power Dissipation @ Temperature Rise: 2.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 32.69°C/W, Fin Height: 0.390" (9.91mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS05-C20-SMT-TR nach Preis ab 1.79 EUR bis 2.35 EUR
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HSS05-C20-SMT-TR | Hersteller : CUI Devices |
Description: HEAT SINK, STAMPING, TO-220, 12. Packaging: Cut Tape (CT) Material: Copper Alloy Length: 1.031" (26.20mm) Shape: Rectangular Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Power Dissipation @ Temperature Rise: 2.3W @ 75°C Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM Thermal Resistance @ Natural: 32.69°C/W Fin Height: 0.390" (9.91mm) Material Finish: Tin Part Status: Active |
auf Bestellung 1380 Stücke: Lieferzeit 21-28 Tag (e) |
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HSS05-C20-SMT-TR | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2 |
auf Bestellung 1357 Stücke: Lieferzeit 14-28 Tag (e) |
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