HSS05-C20-SMT-TR CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 12.
Part Status: Active
Material Finish: Tin
Fin Height: 0.390" (9.91mm)
Thermal Resistance @ Natural: 32.69°C/W
Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Package Cooled: TO-220
Width: 0.500" (12.70mm)
Type: Board Level, Vertical
Shape: Rectangular
Length: 1.031" (26.20mm)
Material: Copper Alloy
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 250+ | 1.28 EUR |
| 500+ | 1.2 EUR |
| 1250+ | 1.09 EUR |
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Technische Details HSS05-C20-SMT-TR CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 12., Part Status: Active, Material Finish: Tin, Fin Height: 0.390" (9.91mm), Thermal Resistance @ Natural: 32.69°C/W, Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 2.3W @ 75°C, Package Cooled: TO-220, Width: 0.500" (12.70mm), Type: Board Level, Vertical, Shape: Rectangular, Length: 1.031" (26.20mm), Material: Copper Alloy, Packaging: Tape & Reel (TR).
Weitere Produktangebote HSS05-C20-SMT-TR nach Preis ab 1.07 EUR bis 1.59 EUR
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HSS05-C20-SMT-TR | CUI Devices |
Description: HEAT SINK, STAMPING, TO-220, 12. Packaging: Cut Tape (CT) Material: Copper Alloy Length: 1.031" (26.20mm) Shape: Rectangular Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Power Dissipation @ Temperature Rise: 2.3W @ 75°C Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM Thermal Resistance @ Natural: 32.69°C/W Fin Height: 0.390" (9.91mm) Material Finish: Tin Part Status: Active |
auf Bestellung 1380 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS05-C20-SMT-TR | Same Sky |
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2 |
auf Bestellung 822 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS05-C20-SMT-TR | CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2 |
auf Bestellung 1239 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSS05-C20-SMT-TR |
|
Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 12.
Packaging: Cut Tape (CT)
Material: Copper Alloy
Length: 1.031" (26.20mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 32.69°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Tin
Part Status: Active
Description: HEAT SINK, STAMPING, TO-220, 12.
Packaging: Cut Tape (CT)
Material: Copper Alloy
Length: 1.031" (26.20mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 32.69°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 1380 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 12+ | 1.5 EUR |
| 25+ | 1.43 EUR |
| 50+ | 1.39 EUR |
| 100+ | 1.37 EUR |
| HSS05-C20-SMT-TR |
|
Hersteller: Same Sky
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2
auf Bestellung 822 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.51 EUR |
| 10+ | 1.34 EUR |
| 25+ | 1.28 EUR |
| 50+ | 1.23 EUR |
| 100+ | 1.19 EUR |
| 250+ | 1.13 EUR |
| 500+ | 1.07 EUR |
| HSS05-C20-SMT-TR |
|
Hersteller: CUI Devices
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2
Heat Sinks heat sink, stamping, TO-220, 12.7 x 26.2
auf Bestellung 1239 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.59 EUR |
| 10+ | 1.52 EUR |
| 25+ | 1.44 EUR |
| 50+ | 1.4 EUR |
| 100+ | 1.38 EUR |
| 250+ | 1.26 EUR |
| 500+ | 1.21 EUR |