HSS07-C20-P274 CUI Devices
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.59 EUR |
| 10+ | 2.48 EUR |
| 25+ | 2.4 EUR |
| 50+ | 2.34 EUR |
| 100+ | 2.2 EUR |
| 250+ | 2.08 EUR |
| 500+ | 1.96 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSS07-C20-P274 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 21., Packaging: Box, Material: Copper Alloy, Length: 0.853" (21.66mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.520" (13.21mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.57°C/W, Fin Height: 0.515" (13.08mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS07-C20-P274 nach Preis ab 1.84 EUR bis 2.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSS07-C20-P274 | CUI Devices |
Description: HEAT SINK, STAMPING, TO-220, 21.Packaging: Box Material: Copper Alloy Length: 0.853" (21.66mm) Shape: Rectangular Type: Board Level, Vertical Width: 0.520" (13.21mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 75°C Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM Thermal Resistance @ Natural: 29.57°C/W Fin Height: 0.515" (13.08mm) Material Finish: Tin Part Status: Active |
auf Bestellung 2233 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSS07-C20-P274 |
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Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 21.
Packaging: Box
Material: Copper Alloy
Length: 0.853" (21.66mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.520" (13.21mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.57°C/W
Fin Height: 0.515" (13.08mm)
Material Finish: Tin
Part Status: Active
Description: HEAT SINK, STAMPING, TO-220, 21.
Packaging: Box
Material: Copper Alloy
Length: 0.853" (21.66mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.520" (13.21mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.57°C/W
Fin Height: 0.515" (13.08mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 2233 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.62 EUR |
| 10+ | 2.5 EUR |
| 25+ | 2.43 EUR |
| 50+ | 2.37 EUR |
| 100+ | 2.24 EUR |
| 250+ | 2.11 EUR |
| 500+ | 1.98 EUR |
| 2000+ | 1.84 EUR |



