HSS07-C20-P274 CUI Devices
auf Bestellung 1669 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.18 EUR |
| 10+ | 2.08 EUR |
| 25+ | 2.02 EUR |
| 50+ | 1.97 EUR |
| 100+ | 1.85 EUR |
| 250+ | 1.75 EUR |
| 500+ | 1.65 EUR |
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Technische Details HSS07-C20-P274 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 21., Packaging: Box, Material: Copper Alloy, Length: 0.853" (21.66mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.520" (13.21mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.57°C/W, Fin Height: 0.515" (13.08mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS07-C20-P274 nach Preis ab 1.55 EUR bis 2.2 EUR
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HSS07-C20-P274 | Hersteller : CUI Devices |
 Description: HEAT SINK, STAMPING, TO-220, 21.Packaging: Box Material: Copper Alloy Length: 0.853" (21.66mm) Shape: Rectangular Type: Board Level, Vertical Width: 0.520" (13.21mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 75°C Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM Thermal Resistance @ Natural: 29.57°C/W Fin Height: 0.515" (13.08mm) Material Finish: Tin Part Status: Active |
auf Bestellung 2233 Stücke: Lieferzeit 10-14 Tag (e) |
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