HSS07-C20-P274 CUI Devices
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.59 EUR |
| 10+ | 2.48 EUR |
| 25+ | 2.4 EUR |
| 50+ | 2.34 EUR |
| 100+ | 2.2 EUR |
| 250+ | 2.08 EUR |
| 500+ | 1.96 EUR |
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Technische Details HSS07-C20-P274 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 21., Part Status: Active, Material Finish: Tin, Fin Height: 0.515" (13.08mm), Thermal Resistance @ Natural: 29.57°C/W, Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 2.5W @ 75°C, Attachment Method: PC Pin, Package Cooled: TO-220, Width: 0.520" (13.21mm), Type: Board Level, Vertical, Shape: Rectangular, Length: 0.853" (21.66mm), Material: Copper Alloy, Packaging: Box.
Weitere Produktangebote HSS07-C20-P274 nach Preis ab 1.84 EUR bis 2.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSS07-C20-P274 | CUI Devices |
 Description: HEAT SINK, STAMPING, TO-220, 21.Part Status: Active Material Finish: Tin Fin Height: 0.515" (13.08mm) Thermal Resistance @ Natural: 29.57°C/W Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 2.5W @ 75°C Attachment Method: PC Pin Package Cooled: TO-220 Width: 0.520" (13.21mm) Type: Board Level, Vertical Shape: Rectangular Length: 0.853" (21.66mm) Material: Copper Alloy Packaging: Box |
auf Bestellung 2233 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSS07-C20-P274 |
|
Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 21.
Part Status: Active
Material Finish: Tin
Fin Height: 0.515" (13.08mm)
Thermal Resistance @ Natural: 29.57°C/W
Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 75°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 0.520" (13.21mm)
Type: Board Level, Vertical
Shape: Rectangular
Length: 0.853" (21.66mm)
Material: Copper Alloy
Packaging: Box
Description: HEAT SINK, STAMPING, TO-220, 21.
Part Status: Active
Material Finish: Tin
Fin Height: 0.515" (13.08mm)
Thermal Resistance @ Natural: 29.57°C/W
Thermal Resistance @ Forced Air Flow: 12.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 75°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 0.520" (13.21mm)
Type: Board Level, Vertical
Shape: Rectangular
Length: 0.853" (21.66mm)
Material: Copper Alloy
Packaging: Box
auf Bestellung 2233 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.62 EUR |
| 10+ | 2.5 EUR |
| 25+ | 2.43 EUR |
| 50+ | 2.37 EUR |
| 100+ | 2.24 EUR |
| 250+ | 2.11 EUR |
| 500+ | 1.98 EUR |
| 2000+ | 1.84 EUR |