| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.75 EUR |
| 10+ | 2.7 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
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Produktbewertung abgeben
Technische Details HSS08-B18-CP Same Sky
Description: HEAT SINK, STAMPING, TO-218, 44., Packaging: Box, Material: Aluminum Alloy, Length: 1.750" (44.45mm), Shape: Square, Type: Board Level, Vertical, Width: 1.750" (44.45mm), Package Cooled: TO-218, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 10.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.29°C/W, Fin Height: 0.492" (12.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS08-B18-CP nach Preis ab 3.14 EUR bis 4.3 EUR
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HSS08-B18-CP | CUI Devices |
 Heat Sinks heat sink, stamping, TO-218, 44.45 x 44. |
auf Bestellung 957 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS08-B18-CP | CUI Devices |
Description: HEAT SINK, STAMPING, TO-218, 44. Packaging: Box Material: Aluminum Alloy Length: 1.750" (44.45mm) Shape: Square Type: Board Level, Vertical Width: 1.750" (44.45mm) Package Cooled: TO-218 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 10.3W @ 75°C Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM Thermal Resistance @ Natural: 7.29°C/W Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 988 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSS08-B18-CP |
|
Hersteller: CUI Devices
Heat Sinks heat sink, stamping, TO-218, 44.45 x 44.
Heat Sinks heat sink, stamping, TO-218, 44.45 x 44.
auf Bestellung 957 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.21 EUR |
| 10+ | 4 EUR |
| 25+ | 3.89 EUR |
| 50+ | 3.8 EUR |
| 100+ | 3.58 EUR |
| 250+ | 3.37 EUR |
| 500+ | 3.14 EUR |
| HSS08-B18-CP |
|
Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-218, 44.
Packaging: Box
Material: Aluminum Alloy
Length: 1.750" (44.45mm)
Shape: Square
Type: Board Level, Vertical
Width: 1.750" (44.45mm)
Package Cooled: TO-218
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 10.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.29°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, STAMPING, TO-218, 44.
Packaging: Box
Material: Aluminum Alloy
Length: 1.750" (44.45mm)
Shape: Square
Type: Board Level, Vertical
Width: 1.750" (44.45mm)
Package Cooled: TO-218
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 10.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.29°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 988 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.3 EUR |
| 10+ | 4.19 EUR |
| 25+ | 4.07 EUR |
| 50+ | 3.84 EUR |
| 100+ | 3.62 EUR |
| 250+ | 3.39 EUR |
| 500+ | 3.28 EUR |