HSS08-B18-CP CUI Devices
auf Bestellung 957 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 5.23 EUR |
| 11+ | 4.97 EUR |
| 25+ | 4.84 EUR |
| 50+ | 4.71 EUR |
| 100+ | 4.45 EUR |
| 250+ | 4.19 EUR |
| 500+ | 3.9 EUR |
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Technische Details HSS08-B18-CP CUI Devices
Description: HEAT SINK, STAMPING, TO-218, 44., Packaging: Box, Material: Aluminum Alloy, Length: 1.750" (44.45mm), Shape: Square, Type: Board Level, Vertical, Width: 1.750" (44.45mm), Package Cooled: TO-218, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 10.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.29°C/W, Fin Height: 0.492" (12.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS08-B18-CP nach Preis ab 4.07 EUR bis 5.33 EUR
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HSS08-B18-CP | Hersteller : CUI Devices |
 Description: HEAT SINK, STAMPING, TO-218, 44.Packaging: Box Material: Aluminum Alloy Length: 1.750" (44.45mm) Shape: Square Type: Board Level, Vertical Width: 1.750" (44.45mm) Package Cooled: TO-218 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 10.3W @ 75°C Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM Thermal Resistance @ Natural: 7.29°C/W Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 988 Stücke: Lieferzeit 21-28 Tag (e) |
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