HSS11-B20-P38 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 50.
Packaging: Box
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 1.260" (32.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.76°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 2150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 1.6 EUR |
| 12+ | 1.54 EUR |
| 25+ | 1.46 EUR |
| 50+ | 1.42 EUR |
| 100+ | 1.4 EUR |
| 250+ | 1.31 EUR |
| 500+ | 1.23 EUR |
| 1000+ | 1.12 EUR |
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Technische Details HSS11-B20-P38 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 50., Packaging: Box, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 1.260" (32.00mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 4.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.76°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote HSS11-B20-P38 nach Preis ab 1.24 EUR bis 1.62 EUR
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HSS11-B20-P38 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 50.8 x 35 x |
auf Bestellung 2442 Stücke: Lieferzeit 10-14 Tag (e) |
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