HSS13-B20-NP CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 31
Packaging: Box
Material: Aluminum Alloy
Length: 1.220" (31.00mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.994" (25.25mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 4.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.50°C/W
Fin Height: 0.508" (12.90mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1198 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 2.65 EUR |
| 11+ | 2.52 EUR |
| 25+ | 2.45 EUR |
| 50+ | 2.38 EUR |
| 100+ | 2.25 EUR |
| 250+ | 2.12 EUR |
| 500+ | 1.99 EUR |
| 1000+ | 1.85 EUR |
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Technische Details HSS13-B20-NP CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 31, Packaging: Box, Material: Aluminum Alloy, Length: 1.220" (31.00mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.994" (25.25mm), Package Cooled: TO-220, Power Dissipation @ Temperature Rise: 4.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 7.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.50°C/W, Fin Height: 0.508" (12.90mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS13-B20-NP nach Preis ab 2 EUR bis 2.7 EUR
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HSS13-B20-NP | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 31 x 25.25 |
auf Bestellung 4986 Stücke: Lieferzeit 14-28 Tag (e) |
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