HSS19-B20-NP CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-218/TO-2
Packaging: Bag
Material: Aluminum Alloy
Length: 0.866" (22.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.35W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 22.39°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2445 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 1.04 EUR |
| 18+ | 1.01 EUR |
| 25+ | 0.98 EUR |
| 50+ | 0.92 EUR |
| 100+ | 0.83 EUR |
| 250+ | 0.82 EUR |
| 500+ | 0.77 EUR |
| 1000+ | 0.76 EUR |
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Technische Details HSS19-B20-NP CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Bag, Material: Aluminum Alloy, Length: 0.866" (22.00mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 3.35W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 22.39°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS19-B20-NP nach Preis ab 0.78 EUR bis 1.06 EUR
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HSS19-B20-NP | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 19 x 22 x 19 mm, no pin |
auf Bestellung 2422 Stücke: Lieferzeit 10-14 Tag (e) |
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