HSS26-B20-P38 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-218/TO-2
Packaging: Bag
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.66°C/W
Fin Height: 0.335" (8.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2998 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 1.37 EUR |
| 100+ | 1.36 EUR |
| 250+ | 1.34 EUR |
| 500+ | 1.25 EUR |
| 1000+ | 1.23 EUR |
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Technische Details HSS26-B20-P38 CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Bag, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 1.378" (35.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 4.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 16.66°C/W, Fin Height: 0.335" (8.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS26-B20-P38 nach Preis ab 1.47 EUR bis 2.01 EUR
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HSS26-B20-P38 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 50.8 x 35 x 8.5 mm, solder pin |
auf Bestellung 2959 Stücke: Lieferzeit 14-28 Tag (e) |
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