HSS26-B20-P38 CUI Devices
Hersteller: CUI DevicesHeat Sinks heat sink, stamping, TO-218/TO-220, 50.8 x 35 x 8.5 mm, solder pin
auf Bestellung 2458 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 0.98 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSS26-B20-P38 CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Bag, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 1.378" (35.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 4.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 16.66°C/W, Fin Height: 0.335" (8.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS26-B20-P38 nach Preis ab 0.89 EUR bis 1.48 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSS26-B20-P38 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, STAMPING, TO-218/TO-2 Packaging: Bag Material: Aluminum Alloy Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.378" (35.00mm) Package Cooled: TO-218, TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 4.5W @ 75°C Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM Thermal Resistance @ Natural: 16.66°C/W Fin Height: 0.335" (8.50mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2998 Stücke: Lieferzeit 10-14 Tag (e) |
|