HSS27-B20-P43 Same Sky
Hersteller: Same Sky
Heat Sinks heat sink, stamping, TO-218/TO-220, 30.3 x 22.2 x 5.35 mm, solder pin
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.87 EUR |
| 10+ | 1.58 EUR |
| 25+ | 1.46 EUR |
| 50+ | 1.38 EUR |
| 100+ | 1.3 EUR |
| 250+ | 1.25 EUR |
Produktrezensionen
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Technische Details HSS27-B20-P43 Same Sky
Description: HEAT SINK, STAMPING, TO-218/TO-2, Thermal Resistance @ Natural: 24.79°C/W, Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.03W @ 75°C, Attachment Method: Bolt On and PC Pin, Package Cooled: TO-218, TO-220, Width: 0.874" (22.20mm), Type: Board Level, Vertical, Shape: Rectangular, Fins, Length: 1.193" (30.30mm), Material: Aluminum Alloy, Packaging: Bag, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.211" (5.35mm).
Weitere Produktangebote HSS27-B20-P43 nach Preis ab 1.25 EUR bis 2.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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HSS27-B20-P43 | CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 30.3 x 22.2 x 5.35 mm, solder pin |
auf Bestellung 2177 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS27-B20-P43 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, STAMPING, TO-218/TO-2Thermal Resistance @ Natural: 24.79°C/W Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.03W @ 75°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-218, TO-220 Width: 0.874" (22.20mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.193" (30.30mm) Material: Aluminum Alloy Packaging: Bag Part Status: Active Material Finish: Black Anodized Fin Height: 0.211" (5.35mm) |
auf Bestellung 2055 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSS27-B20-P43 |
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Hersteller: CUI Devices
Heat Sinks heat sink, stamping, TO-218/TO-220, 30.3 x 22.2 x 5.35 mm, solder pin
Heat Sinks heat sink, stamping, TO-218/TO-220, 30.3 x 22.2 x 5.35 mm, solder pin
auf Bestellung 2177 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.88 EUR |
| 10+ | 1.78 EUR |
| 25+ | 1.74 EUR |
| 50+ | 1.69 EUR |
| 100+ | 1.59 EUR |
| 250+ | 1.51 EUR |
| 500+ | 1.42 EUR |
| HSS27-B20-P43 |
![]() |
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, STAMPING, TO-218/TO-2
Thermal Resistance @ Natural: 24.79°C/W
Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.03W @ 75°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-218, TO-220
Width: 0.874" (22.20mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.193" (30.30mm)
Material: Aluminum Alloy
Packaging: Bag
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.211" (5.35mm)
Description: HEAT SINK, STAMPING, TO-218/TO-2
Thermal Resistance @ Natural: 24.79°C/W
Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.03W @ 75°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-218, TO-220
Width: 0.874" (22.20mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.193" (30.30mm)
Material: Aluminum Alloy
Packaging: Bag
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.211" (5.35mm)
auf Bestellung 2055 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.07 EUR |
| 12+ | 1.76 EUR |
| 25+ | 1.63 EUR |
| 50+ | 1.52 EUR |
| 100+ | 1.43 EUR |
| 250+ | 1.31 EUR |
| 500+ | 1.25 EUR |


