HSS27-B20-P43 CUI Devices
Hersteller: CUI DevicesHeat Sinks heat sink, stamping, TO-218/TO-220, 30.3 x 22.2 x 5.35 mm, solder pin
auf Bestellung 2177 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.58 EUR |
| 10+ | 1.5 EUR |
| 25+ | 1.46 EUR |
| 50+ | 1.42 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.27 EUR |
| 500+ | 1.19 EUR |
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Technische Details HSS27-B20-P43 CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Bag, Material: Aluminum Alloy, Length: 1.193" (30.30mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.874" (22.20mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 3.03W @ 75°C, Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.79°C/W, Fin Height: 0.211" (5.35mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS27-B20-P43 nach Preis ab 1.05 EUR bis 1.74 EUR
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HSS27-B20-P43 | Hersteller : Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, STAMPING, TO-218/TO-2 Packaging: Bag Material: Aluminum Alloy Length: 1.193" (30.30mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.874" (22.20mm) Package Cooled: TO-218, TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 3.03W @ 75°C Thermal Resistance @ Forced Air Flow: 13.20°C/W @ 200 LFM Thermal Resistance @ Natural: 24.79°C/W Fin Height: 0.211" (5.35mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2055 Stücke: Lieferzeit 10-14 Tag (e) |
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