Produkte > SAMTEC > HTST-108-01-L-DV
HTST-108-01-L-DV

HTST-108-01-L-DV Samtec

htst-2854338.pdf Hersteller: Samtec
Headers & Wire Housings .100" High-Temp Shrouded Terminal Strip, Cable Mate
auf Bestellung 1007 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
6+8.97 EUR
10+ 7.51 EUR
100+ 6.45 EUR
500+ 5.64 EUR
1000+ 4.97 EUR
Mindestbestellmenge: 6
Produktrezensionen
Produktbewertung abgeben

Technische Details HTST-108-01-L-DV Samtec

Description: CONN HEADER SMD 16POS 2.54MM, Features: Keying Slot, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 3.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 16, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).

Weitere Produktangebote HTST-108-01-L-DV nach Preis ab 6.65 EUR bis 9.8 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
HTST-108-01-L-DV HTST-108-01-L-DV Hersteller : Samtec Inc. htst.pdf Description: CONN HEADER SMD 16POS 2.54MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 16
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
auf Bestellung 621 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+9.8 EUR
10+ 8.88 EUR
100+ 7.82 EUR
500+ 6.65 EUR
Mindestbestellmenge: 3
HTST-108-01-L-DV HTST-108-01-L-DV Hersteller : SAMTEC SAMIS16612-1.pdf?hkey=6D3A4C79FDBF58556ACFDE234799DDF0 Description: SAMTEC - HTST-108-01-L-DV - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 16 Kontakt(e), Oberflächenmontage, HTST
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 16Contacts
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Produktpalette: HTST
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Rows
Rastermaß: 2.54mm
SVHC: No SVHC (14-Jun-2023)
auf Bestellung 411 Stücke:
Lieferzeit 14-21 Tag (e)