HTST-113-01-T-DV Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.02 EUR |
| 56+ | 3.95 EUR |
| 112+ | 3.36 EUR |
| 504+ | 2.89 EUR |
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Technische Details HTST-113-01-T-DV Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Features: Keying Slot, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 3.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Weitere Produktangebote HTST-113-01-T-DV nach Preis ab 4.11 EUR bis 6.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||
|---|---|---|---|---|---|---|---|---|---|
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HTST-113-01-T-DV | Samtec Inc. |
 Description: CONN HEADER SMD 26POS 2.54MMFeatures: Keying Slot Packaging: Tube Connector Type: Header Current Rating (Amps): 3.4A per Contact Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.250" (6.35mm) |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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HTST-113-01-T-DV | SAMTEC |
Description: SAMTEC - HTST-113-01-T-DV - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, HTST tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 26Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: HTST productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 53 Stücke: Lieferzeit 14-21 Tag (e) |
|
| HTST-113-01-T-DV |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 26POS 2.54MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
Description: CONN HEADER SMD 26POS 2.54MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.82 EUR |
| 10+ | 4.11 EUR |
| HTST-113-01-T-DV |
|
Hersteller: SAMTEC
Description: SAMTEC - HTST-113-01-T-DV - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, HTST
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 26Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: HTST
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - HTST-113-01-T-DV - Stiftleiste, Wire-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, HTST
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 26Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: HTST
productTraceability: No
Kontaktanschluss: Oberflächenmontage
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 53 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 41+ | 6.09 EUR |
| 44+ | 5.3 EUR |