ICF-308-S-O-TR Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 5.37 EUR |
| 50+ | 4.38 EUR |
| 100+ | 3.73 EUR |
| 900+ | 3.31 EUR |
| 1800+ | 3.22 EUR |
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Technische Details ICF-308-S-O-TR Samtec
Description: CONN IC DIP SOCKET 8POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).
Weitere Produktangebote ICF-308-S-O-TR nach Preis ab 4.09 EUR bis 5.67 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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ICF-308-S-O-TR | Samtec Inc. |
 Description: CONN IC DIP SOCKET 8POS TINContact Material - Post: Beryllium Copper Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Liquid Crystal Polymer (LCP) Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Cut Tape (CT) |
auf Bestellung 298 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICF-308-S-O-TR |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Cut Tape (CT)
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.67 EUR |
| 10+ | 4.82 EUR |
| 25+ | 4.51 EUR |
| 50+ | 4.3 EUR |
| 100+ | 4.09 EUR |