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ICF-632-S-O-TR

ICF-632-S-O-TR Samtec

icf.pdf
Hersteller: Samtec
IC & Component Sockets .100" Surface Mount Screw Machine DIP Socket
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+10.98 EUR
10+10.51 EUR
25+10.21 EUR
50+10 EUR
100+8.68 EUR
275+8.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details ICF-632-S-O-TR Samtec

Description: CONN IC DIP SOCKET 32POS TIN, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).

Weitere Produktangebote ICF-632-S-O-TR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
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ICF-632-S-O-TR ICF-632-S-O-TR Samtec Inc. icf-xxx-xxx-x-xx-mkt.pdf Description: CONN IC DIP SOCKET 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ICF-632-S-O-TR ICF-632-S-O-TR Samtec Inc. icf-xxx-xxx-x-xx-mkt.pdf Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ICF-632-S-O-TR icf-xxx-xxx-x-xx-mkt.pdf
ICF-632-S-O-TR
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ICF-632-S-O-TR icf-xxx-xxx-x-xx-mkt.pdf
ICF-632-S-O-TR
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH