ICF-632-S-O-TR Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 13.42 EUR |
| 10+ | 13.4 EUR |
| 50+ | 13.39 EUR |
| 100+ | 11.33 EUR |
| 275+ | 11.27 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details ICF-632-S-O-TR Samtec
Description: CONN IC DIP SOCKET 32POS TIN, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICF-632-S-O-TR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
ICF-632-S-O-TR | Samtec Inc. |
 Description: CONN IC DIP SOCKET 32POS TINFeatures: Open Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 275 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
|
ICF-632-S-O-TR | Samtec Inc. |
Description: CONN IC DIP SOCKET 32POS TIN Features: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
 |
ICF-632-S-O-TR | Samtec |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 275 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
|
ICF-632-S-O-TR | Samtec |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 275 Stücke Im Einkaufswagen Stück im Wert von UAH |
| ICF-632-S-O-TR |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 275 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ICF-632-S-O-TR |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ICF-632-S-O-TR |
|
Hersteller: Samtec
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Produkt ist nicht verfügbar
Mindestbestellmenge: 275 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ICF-632-S-O-TR |
|
Hersteller: Samtec
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R
Produkt ist nicht verfügbar
Mindestbestellmenge: 275 Stücke
Im Einkaufswagen
Stück im Wert von UAH