ICF-632-S-O-TR Samtec
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 13.22 EUR |
| 10+ | 12.21 EUR |
| 25+ | 11.56 EUR |
| 50+ | 11.12 EUR |
| 100+ | 9.38 EUR |
| 275+ | 9.13 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ICF-632-S-O-TR Samtec
Description: CONN IC DIP SOCKET 32POS TIN, Packaging: Tape & Reel (TR), Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICF-632-S-O-TR nach Preis ab 11.71 EUR bis 19.57 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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ICF-632-S-O-TR | Hersteller : Samtec Inc. |
 Description: CONN IC DIP SOCKET 32POS TINPackaging: Cut Tape (CT) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 271 Stücke: Lieferzeit 10-14 Tag (e) |
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ICF-632-S-O-TR | Hersteller : Samtec |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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ICF-632-S-O-TR | Hersteller : Samtec |
Conn DIP Socket SKT 32 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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ICF-632-S-O-TR | Hersteller : Samtec Inc. |
Description: CONN IC DIP SOCKET 32POS TIN Packaging: Tape & Reel (TR) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |