ICM-308-1-GT-HT Adam Tech
| Anzahl | Privatkunde |
|---|---|
| 4+ | 0.98 EUR |
| 5+ | 0.95 EUR |
| 10+ | 0.86 EUR |
| 25+ | 0.8 EUR |
| 60+ | 0.75 EUR |
| 120+ | 0.73 EUR |
| 300+ | 0.67 EUR |
Produktrezensionen
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Technische Details ICM-308-1-GT-HT Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 8P, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICM-308-1-GT-HT nach Preis ab 0.74 EUR bis 1.3 EUR
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ICM-308-1-GT-HT | Adam Tech |
 Description: MACHINE PIN SOCKET, IC, DIP, 8PFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 6936 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICM-308-1-GT-HT |
|
Hersteller: Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 8P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: MACHINE PIN SOCKET, IC, DIP, 8P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 6936 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 17+ | 1.3 EUR |
| 20+ | 1.09 EUR |
| 25+ | 1.02 EUR |
| 60+ | 0.96 EUR |
| 120+ | 0.92 EUR |
| 300+ | 0.86 EUR |
| 540+ | 0.83 EUR |
| 1020+ | 0.79 EUR |
| 2520+ | 0.74 EUR |