ICM-624-1-GT-HT Adam Tech
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.3 EUR |
| 10+ | 3.64 EUR |
| 20+ | 3.37 EUR |
| 100+ | 3.22 EUR |
| 260+ | 2.95 EUR |
| 500+ | 2.76 EUR |
| 1000+ | 2.64 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details ICM-624-1-GT-HT Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 24P, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote ICM-624-1-GT-HT nach Preis ab 2.83 EUR bis 4.61 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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ICM-624-1-GT-HT | Adam Tech |
 Description: MACHINE PIN SOCKET, IC, DIP, 24PFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
auf Bestellung 1523 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICM-624-1-GT-HT |
|
Hersteller: Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 24P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Description: MACHINE PIN SOCKET, IC, DIP, 24P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
auf Bestellung 1523 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.61 EUR |
| 20+ | 3.74 EUR |
| 40+ | 3.56 EUR |
| 60+ | 3.45 EUR |
| 100+ | 3.33 EUR |
| 260+ | 3.12 EUR |
| 500+ | 2.98 EUR |
| 1000+ | 2.83 EUR |