ICS-316-T Adam Tech

Description: IC SOCKET, DIP, 16P 2.54MM PITCH
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
auf Bestellung 3476 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
84+ | 0.21 EUR |
95+ | 0.19 EUR |
102+ | 0.17 EUR |
120+ | 0.16 EUR |
270+ | 0.15 EUR |
510+ | 0.14 EUR |
2520+ | 0.13 EUR |
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Technische Details ICS-316-T Adam Tech
Description: IC SOCKET, DIP, 16P 2.54MM PITCH, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze.