IPC0033-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm)
Number of Positions: 68
Description: QFN-68 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm)
Number of Positions: 68
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Technische Details IPC0033-S Chip Quik Inc.
Description: QFN-68 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: QFN/LFCSP, Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.303" L x 0.303" W (7.70mm x 7.70mm), Number of Positions: 68.
Weitere Produktangebote IPC0033-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0033-S | Hersteller : Chip Quik | Sockets & Adapters QFN-68 Stainless Steel Stencil |
Produkt ist nicht verfügbar |