IPC0092-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
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Technische Details IPC0092-S Chip Quik Inc.
Description: POWERSSOP-30 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.026" (0.65mm), Type: PowerSSOP, Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm), Number of Positions: 30.
Weitere Produktangebote IPC0092-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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IPC0092-S | Hersteller : Chip Quik | Sockets & Adapters PowerSSOP-30 Stencil |
Produkt ist nicht verfügbar |