IPC0209 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
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Technische Details IPC0209 Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT, Packaging: Bulk, Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.025" (0.64mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: QSOP, Part Status: Active.