Produkte > CHIP QUIK INC. > IPC0209

IPC0209 Chip Quik Inc.

Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Part Status: Active
Package Accepted: QSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 28
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Packaging: Bulk

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Technische Details IPC0209 Chip Quik Inc.

Description: POWERQSOP-28 TO DIP-32 SMT ADAPT, Part Status: Active, Package Accepted: QSOP, Proto Board Type: SMD to DIP, Board Thickness: 0.063" (1.60mm), Pitch: 0.025" (0.64mm), Number of Positions: 28, Material: FR4 Epoxy Glass, Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm), Packaging: Bulk.