IPC0218-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm)
Number of Positions: 20
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm)
Number of Positions: 20
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Technische Details IPC0218-S Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 3.5 X 3.5 M, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: QFN, Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.081" L x 0.081" W (2.05mm x 2.05mm), Number of Positions: 20.