IPC0238-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
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Technische Details IPC0238-S Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.016" (0.40mm), Type: HTQFP, Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm), Number of Positions: 64.