Technische Details IW-HSKALU-CLASLR-CU03 iWave Global
Description: ZU+ MPSOC SOM MODULE HEATSINK, Part Status: Active, Fin Height: 1.181" (30.00mm), Attachment Method: Bolt On, Package Cooled: FPGA, Width: 2.953" (75.00mm), Type: Top Mount, Shape: Rectangular, Fins, Length: 3.740" (95.00mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote IW-HSKALU-CLASLR-CU03 nach Preis ab 96.8 EUR bis 100.67 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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IW-HSKALU-CLASLR-CU03 | iWave Systems |
Description: ZU+ MPSOC SOM MODULE HEATSINK Part Status: Active Fin Height: 1.181" (30.00mm) Attachment Method: Bolt On Package Cooled: FPGA Width: 2.953" (75.00mm) Type: Top Mount Shape: Rectangular, Fins Length: 3.740" (95.00mm) Material: Aluminum Packaging: Bulk |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IW-HSKALU-CLASLR-CU03 | iWave Systems |
 Heat Sinks Zynq UltraScale+ MPSoC SOM module heatsink |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
| IW-HSKALU-CLASLR-CU03 |
Hersteller: iWave Systems
Description: ZU+ MPSOC SOM MODULE HEATSINK
Part Status: Active
Fin Height: 1.181" (30.00mm)
Attachment Method: Bolt On
Package Cooled: FPGA
Width: 2.953" (75.00mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 3.740" (95.00mm)
Material: Aluminum
Packaging: Bulk
Description: ZU+ MPSOC SOM MODULE HEATSINK
Part Status: Active
Fin Height: 1.181" (30.00mm)
Attachment Method: Bolt On
Package Cooled: FPGA
Width: 2.953" (75.00mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 3.740" (95.00mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 96.8 EUR |
| IW-HSKALU-CLASLR-CU03 |
|
Hersteller: iWave Systems
Heat Sinks Zynq UltraScale+ MPSoC SOM module heatsink
Heat Sinks Zynq UltraScale+ MPSoC SOM module heatsink
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 100.67 EUR |