K66X-E15S-N30 Kycon, Inc.
Hersteller: Kycon, Inc.Description: CONN D-SUB HD RCPT 15P R/A SLDR
Packaging: Tray
Features: Board Lock
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Current Rating (Amps): 1.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 15
Number of Rows: 3
Contact Type: Signal
Flange Feature: Housing/Shell (4-40)
Termination: Solder
Connector Style: D-Sub, High Density
Contact Finish Thickness: 30.0µin (0.76µm)
Material Flammability Rating: UL94 V-0
Shell Material, Finish: Steel, Nickel Plated
Shell Size, Connector Layout: 1 (DE, E) High Density
Part Status: Active
Backset Spacing: 0.350" (8.89mm)
auf Bestellung 1097 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.92 EUR |
| 10+ | 13.50 EUR |
| 25+ | 12.75 EUR |
| 45+ | 12.44 EUR |
| 90+ | 11.82 EUR |
| 270+ | 10.57 EUR |
| 450+ | 9.95 EUR |
| 945+ | 8.71 EUR |
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Technische Details K66X-E15S-N30 Kycon, Inc.
Description: CONN D-SUB HD RCPT 15P R/A SLDR, Packaging: Tray, Features: Board Lock, Connector Type: Receptacle, Female Sockets, Contact Finish: Gold, Current Rating (Amps): 1.5A, Mounting Type: Through Hole, Right Angle, Number of Positions: 15, Number of Rows: 3, Contact Type: Signal, Flange Feature: Housing/Shell (4-40), Termination: Solder, Connector Style: D-Sub, High Density, Contact Finish Thickness: 30.0µin (0.76µm), Material Flammability Rating: UL94 V-0, Shell Material, Finish: Steel, Nickel Plated, Shell Size, Connector Layout: 1 (DE, E) High Density, Part Status: Active, Backset Spacing: 0.350" (8.89mm).
Weitere Produktangebote K66X-E15S-N30
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| K66X-E15S-N30 | Hersteller : Kycon |
D-Sub High Density Connectors .350 15P RECPT R/A BRD LOCK 30u GOLD |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |