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KF66X-E15S-N30 Kycon, Inc.


KF66X-E15S-N.pdf Hersteller: Kycon, Inc.
Description: CONN D-SUB HD RCPT 15P R/A SLDR
Packaging: Tray
Features: Board Lock
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Current Rating (Amps): 1.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 15
Number of Rows: 3
Contact Type: Signal
Flange Feature: Housing/Shell (4-40)
Termination: Solder
Connector Style: D-Sub, High Density
Contact Finish Thickness: 30.0µin (0.76µm)
Material Flammability Rating: UL94 V-0
Shell Material, Finish: Steel, Nickel Plated
Shell Size, Connector Layout: 1 (DE, E) High Density
Part Status: Active
Backset Spacing: 0.350" (8.89mm)
auf Bestellung 450 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.1 EUR
10+ 18.09 EUR
25+ 17.04 EUR
45+ 16.6 EUR
90+ 16.16 EUR
270+ 14.42 EUR
450+ 13.54 EUR
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Technische Details KF66X-E15S-N30 Kycon, Inc.

Description: CONN D-SUB HD RCPT 15P R/A SLDR, Packaging: Tray, Features: Board Lock, Connector Type: Receptacle, Female Sockets, Contact Finish: Gold, Current Rating (Amps): 1.5A, Mounting Type: Through Hole, Right Angle, Number of Positions: 15, Number of Rows: 3, Contact Type: Signal, Flange Feature: Housing/Shell (4-40), Termination: Solder, Connector Style: D-Sub, High Density, Contact Finish Thickness: 30.0µin (0.76µm), Material Flammability Rating: UL94 V-0, Shell Material, Finish: Steel, Nickel Plated, Shell Size, Connector Layout: 1 (DE, E) High Density, Part Status: Active, Backset Spacing: 0.350" (8.89mm).

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KF66X-E15S-N30 Hersteller : Kycon KF66X-334687.pdf D-Sub High Density Connectors D15 ML VFORMED 1.2MM FE-B/L J/S 30U
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