LPAM-30-01.5-S-06-2-K-TR Samtec
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Technische Details LPAM-30-01.5-S-06-2-K-TR Samtec
Description: .050" LP ARRAY HIGH-SPEED HIGH-D, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Connector Type: Array, Male Pins, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 180, Pitch: 0.050" (1.27mm), Height Above Board: 0.165" (4.20mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 4.5mm, 5mm, Number of Rows: 6.
Weitere Produktangebote LPAM-30-01.5-S-06-2-K-TR
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LPAM-30-01.5-S-06-2-K-TR | Hersteller : Samtec |
 Conn Open Pin Field Array M 180 POS 1.27mm Solder ST Top Entry SMD T/R |
Produkt ist nicht verfügbar |
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| LPAM-30-01.5-S-06-2-K-TR | Hersteller : Samtec Inc. |
Description: .050" LP ARRAY HIGH-SPEED HIGH-D Packaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Array, Male Pins Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.165" (4.20mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |