LPC2290FBD144,551 NXP Semiconductors
Hersteller: NXP SemiconductorsMCU 16-bit/32-bit ARM7TDMI-S RISC ROMLess 1.8V/3.3V Automotive 144-Pin LQFP Tray
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Technische Details LPC2290FBD144,551 NXP Semiconductors
Description: IC MCU 16/32BIT ROMLESS 144LQFP, Packaging: Bag, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Part Status: Obsolete, Number of I/O: 76.
Weitere Produktangebote LPC2290FBD144,551
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LPC2290FBD144,551 | Hersteller : NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP Packaging: Bag Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 76 |
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