LT18CJ1922 Laird Technologies EMI
Hersteller: Laird Technologies EMI
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1
Packaging: Bulk
Material: Beryllium Copper
Length: 4.657" (118.28mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Height: 0.110" (2.79mm)
Attachment Method: Slot
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1
Packaging: Bulk
Material: Beryllium Copper
Length: 4.657" (118.28mm)
Type: Fingerstock
Width: 0.320" (8.13mm)
Height: 0.110" (2.79mm)
Attachment Method: Slot
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.65 EUR |
10+ | 5.08 EUR |
25+ | 4.8 EUR |
100+ | 4.16 EUR |
250+ | 3.95 EUR |
500+ | 3.54 EUR |
Produktrezensionen
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Technische Details LT18CJ1922 Laird Technologies EMI
Description: VSLMT,STR,BF 0.11*0.32*2.039*0.1, Packaging: Bulk, Material: Beryllium Copper, Length: 4.657" (118.28mm), Type: Fingerstock, Width: 0.320" (8.13mm), Height: 0.110" (2.79mm), Attachment Method: Slot, Plating: Tin, Plating - Thickness: 299.99µin (7.62µm), Part Status: Active.