M813QEAA MEIG SMART TECHNOLOGY
Hersteller: MEIG SMART TECHNOLOGYCategory: M2M (GPRS/LTE/5G) modules
Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35
Type of communications module: 5G
Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0
Dimensions: 32x29x2.4mm
Operating temperature: -30...75°C
Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78
Components: Qualcomm Snapdragon X35
Transmission: 5G; LTE
Anzahl je Verpackung: 1 Stücke
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Technische Details M813QEAA MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules, Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35, Type of communications module: 5G, Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0, Dimensions: 32x29x2.4mm, Operating temperature: -30...75°C, Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78, Components: Qualcomm Snapdragon X35, Transmission: 5G; LTE, Anzahl je Verpackung: 1 Stücke.
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| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| M813QEAA | Hersteller : MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35 Type of communications module: 5G Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0 Dimensions: 32x29x2.4mm Operating temperature: -30...75°C Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78 Components: Qualcomm Snapdragon X35 Transmission: 5G; LTE |
Produkt ist nicht verfügbar |