M828G23D MEIG SMART TECHNOLOGY
Hersteller: MEIG SMART TECHNOLOGYCategory: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Dimensions: 37x39.5x2.8mm
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Case: LGA
Operating temperature: -30...75°C
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Anzahl je Verpackung: 1 Stücke
auf Bestellung 19 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 61.52 EUR |
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Technische Details M828G23D MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules, Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm, Type of communications module: LTE, Dimensions: 37x39.5x2.8mm, Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART, Case: LGA, Operating temperature: -30...75°C, Downlink transfer rate: 300Mbps, Uplink ransfer rate: 50Mbps, Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA, Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote M828G23D nach Preis ab 61.52 EUR bis 61.52 EUR
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M828G23D | Hersteller : MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Dimensions: 37x39.5x2.8mm Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Case: LGA Operating temperature: -30...75°C Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP |
auf Bestellung 19 Stücke: Lieferzeit 14-21 Tag (e) |
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