MBC50-33B13 MACOM Technology Solutions
Hersteller: MACOM Technology Solutions
Description: CAP SILICON 33PF 20% 50V SMD
Tolerance: ±20%
Packaging: Tray
Package / Case: Nonstandard Chip
Size / Dimension: 2.461" L x 1.772" W (62.50mm x 45.00mm)
Operating Temperature: -55°C ~ 200°C
Height: 0.179" (4.55mm)
Applications: High Stability
Part Status: Active
Capacitance: 33 pF
Voltage - Breakdown: 50 V
Description: CAP SILICON 33PF 20% 50V SMD
Tolerance: ±20%
Packaging: Tray
Package / Case: Nonstandard Chip
Size / Dimension: 2.461" L x 1.772" W (62.50mm x 45.00mm)
Operating Temperature: -55°C ~ 200°C
Height: 0.179" (4.55mm)
Applications: High Stability
Part Status: Active
Capacitance: 33 pF
Voltage - Breakdown: 50 V
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
50+ | 20.39 EUR |
100+ | 17.96 EUR |
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Technische Details MBC50-33B13 MACOM Technology Solutions
Description: CAP SILICON 33PF 20% 50V SMD, Tolerance: ±20%, Packaging: Tray, Package / Case: Nonstandard Chip, Size / Dimension: 2.461" L x 1.772" W (62.50mm x 45.00mm), Operating Temperature: -55°C ~ 200°C, Height: 0.179" (4.55mm), Applications: High Stability, Part Status: Active, Capacitance: 33 pF, Voltage - Breakdown: 50 V.