Produkte > MOREK > MBG0001G24
MBG0001G24

MBG0001G24 MOREK


Insugel One ENG.pdf Insugel One DE.pdf
Hersteller: MOREK
Category: Encapsulating materials
Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 1kg
Type of chemical agent: silicone encapsulating compound
Application: filling; isolation
Operating temperature: -60...200°C
Dielectric strength: 23kV/mm
Agent features: high dielectric strength
Net weight: 1kg
Kind of package: bucket
auf Bestellung 5 Stücke:

Lieferzeit 14-21 Tag (e)
Anzahl Preis
1+96.32 EUR
3+88.19 EUR
5+74.75 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details MBG0001G24 MOREK

Category: Encapsulating materials, Description: Silicone encapsulating compound; -60÷200°C; 23kV/mm; 1kg, Type of chemical agent: silicone encapsulating compound, Application: filling; isolation, Operating temperature: -60...200°C, Dielectric strength: 23kV/mm, Agent features: high dielectric strength, Net weight: 1kg, Kind of package: bucket.