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MBG0002G24

MBG0002G24 MOREK

Insugel One ENG.pdf Insugel One DE.pdf
Hersteller: MOREK
Category: Encapsulating materials
Description: Silicone; encapsulating compound; -60÷200°C; 23kV/mm; 300g
Operating temperature: -60...200°C
Type of agent: silicone
Agent features: high dielectric strength
Net weight: 300g
Kind of package: tube
Appearance: encapsulating compound
Application: filling; isolation
Dielectric strength: 23kV/mm
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Technische Details MBG0002G24 MOREK

Category: Encapsulating materials, Description: Silicone; encapsulating compound; -60÷200°C; 23kV/mm; 300g, Operating temperature: -60...200°C, Type of agent: silicone, Agent features: high dielectric strength, Net weight: 300g, Kind of package: tube, Appearance: encapsulating compound, Application: filling; isolation, Dielectric strength: 23kV/mm.