MC68HC11F1CFN3R2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 30
DigiKey Programmable: Not Verified
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Technische Details MC68HC11F1CFN3R2 NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC, Packaging: Tape & Reel (TR), Package / Case: 68-LCC (J-Lead), Mounting Type: Surface Mount, Speed: 3MHz, RAM Size: 1K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, EEPROM Size: 512 x 8, Core Processor: HC11, Data Converters: A/D 8x8b, Core Size: 8-Bit, Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V, Connectivity: SCI, SPI, Peripherals: POR, WDT, Supplier Device Package: 68-PLCC (24.21x24.21), Number of I/O: 30, DigiKey Programmable: Not Verified.