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Technische Details MCZ33903CD3EK NXP / Freescale
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3, Packaging: Bulk, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Interface: CAN, LIN, Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Supplier Device Package: 32-SOIC-EP, Part Status: Active.
Weitere Produktangebote MCZ33903CD3EK
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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MCZ33903CD3EK | Freescale Semiconductor |
 Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3Packaging: Bulk Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCZ33903CD3EK |
|
Hersteller: Freescale Semiconductor
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 47 Stücke
Im Einkaufswagen
Stück im Wert von UAH