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Technische Details MCZ33903CD3EK NXP / Freescale
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3, Mounting Type: Surface Mount, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Packaging: Bulk, Supplier Device Package: 32-SOIC-EP, Applications: System Basis Chip, Voltage - Supply: 5.5V ~ 28V, Interface: CAN, LIN, Part Status: Active.
Weitere Produktangebote MCZ33903CD3EK
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
MCZ33903CD3EK | Freescale Semiconductor |
 Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Bulk Supplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCZ33903CD3EK |
|
Hersteller: Freescale Semiconductor
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Part Status: Active
Description: SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH