MOLC-130-M1-L-Q-LC Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HEADER SMD T/H 120P 1.27MM
Features: Board Lock
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.6A per Contact
Mounting Type: Surface Mount, Through Hole
Number of Positions: 120
Number of Rows: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.075" (1.91mm)
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.133" (3.38mm)
Description: CONN HEADER SMD T/H 120P 1.27MM
Features: Board Lock
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.6A per Contact
Mounting Type: Surface Mount, Through Hole
Number of Positions: 120
Number of Rows: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.075" (1.91mm)
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.133" (3.38mm)
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 74.06 EUR |
| 10+ | 64.85 EUR |
| 100+ | 58.05 EUR |
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Technische Details MOLC-130-M1-L-Q-LC Samtec Inc.
Description: CONN HEADER SMD T/H 120P 1.27MM, Features: Board Lock, Packaging: Bulk, Connector Type: Header, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Through Hole, Number of Positions: 120, Number of Rows: 4, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.075" (1.91mm), Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.133" (3.38mm).