MPC8358CVRADDDA557 NXP Semiconductors
Hersteller: NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Description: IC MPU MPC83XX 266MHZ 668TEPBGA
Packaging: Bulk
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-TEPBGA (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 143.88 EUR |
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Technische Details MPC8358CVRADDDA557 NXP Semiconductors
Description: IC MPU MPC83XX 266MHZ 668TEPBGA, Packaging: Bulk, Package / Case: 668-BBGA Exposed Pad, Mounting Type: Surface Mount, Speed: 266MHz, Operating Temperature: -40°C ~ 105°C (TA), Core Processor: PowerPC e300, Voltage - I/O: 1.8V, 2.5V, 3.3V, Supplier Device Package: 668-TEPBGA (29x29), Ethernet: 10/100/1000Mbps (1), USB: USB 1.x (1), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; QUICC Engine, Security; SEC, RAM Controllers: DDR, DDR2, Graphics Acceleration: No, Security Features: Cryptography, Random Number Generator, Part Status: Active.