MPF100TC-FCSG325T2 Microchip Technology
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-BGA (11x11)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Grade: Automotive
Number of I/O: 170
Qualification: AEC-Q100
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-BGA (11x11)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Grade: Automotive
Number of I/O: 170
Qualification: AEC-Q100
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Technische Details MPF100TC-FCSG325T2 Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES, Packaging: Tray, Package / Case: 325-TFBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TJ), Voltage - Supply: 0.97V ~ 1.08V, Number of Logic Elements/Cells: 109000, Supplier Device Package: 325-BGA (11x11), Number of LABs/CLBs: 27250, Total RAM Bits: 7969178, Grade: Automotive, Number of I/O: 170, Qualification: AEC-Q100.