MQ172-3PA(55) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 3P 0.031 GOLD SMD R/A
Insulation Height: 0.154" (3.90mm)
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.031" (0.80mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Friction Lock
Contact Type: Center Strip Contact
Operating Temperature: -30°C ~ 75°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount, Right Angle
Current Rating (Amps): 3A
Voltage Rating: 30VDC, 40VAC
Connector Type: Receptacle
Features: Board Guide, Solder Retention
Packaging: Tray
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Technische Details MQ172-3PA(55) Hirose Electric Co Ltd
Description: CONN RCPT 3P 0.031 GOLD SMD R/A, Insulation Height: 0.154" (3.90mm), Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.031" (0.80mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Friction Lock, Contact Type: Center Strip Contact, Operating Temperature: -30°C ~ 75°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 3, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3A, Voltage Rating: 30VDC, 40VAC, Connector Type: Receptacle, Features: Board Guide, Solder Retention, Packaging: Tray.

